Palomar Sr. Scientist, Daniel D. Evans Jr., delves into the world of Wire Bonding, using the Chain Bonding method, of an RF-SOE Packgage. Mr. Evans also discusses the practical application comparison, including cost and yield, of a Ball Bonder vs. a Wedge Bonder.
This Ebook includes a Slide Presentation + a Scientific Paper details tests and results. Explained in detail are the following:
This paper and presentation were part of the Wire Bonding Seminar at Electronic Manufactures and Packaging Conference 2009, held in Rimini, Italy.