Wire Bonders' Speak

Who doesn't like to go to Italy on a business trip? It was never surprising to see my Mom suddenly become interested in my Dad's business when his business required him to travel to Europe, specifically to Italy.

Well, this is that time of year again and Europe is hot with innovations in the Microelectronic and Optoelectronic Packaging Industry. Palomar's Sr. Scentist, Daniel D. Evans Jr., is gearing up to travel to Italy (with his wife of course!) to present a paper on "Chain Wire Bonding of a RF-SOE Package using a Gold Ball Bonder". 

Mr. Evans will be presenting at EMPC at the Wirebonding Seminar on Monday, June 15th. He will be discussing new Ball Bonding technology as an excellent alternative to traditonal Wedge Bonding. It will introduce the RF-SOE Package Wire Bonding requirements then actual results achieved using chain bonding technology. The abstract of the paper is as follows:

"RF-SOE power transistors are traditionally wire bonded using gold wedge bonders to create strings of loop profiles with short and long wires. A Ball Bond technology, referred to as Chain Bonding, creates a ball-loop-stitch-loop-stitch-loop-stitch - this is demonstrated as an alternative to these traditional wedge bond solutions. Initial Chain Bonding results using a Ball Bonder produced comparable performance as a wedge bonded product, but using more prevelant ball bonding technology." This process is can only be accomplished by using a highly versatile, accurate and precise wire bonder. 

 RF-SOE package

Chain Bonding technology is applied to matrix LED packages, RF-SOE packages and other packages that require a string of interconnections.

Other companies presenting on Monday at the Wirebonding seminar include ESEC, Heese & Knipps, K & S, ASM, F K Delvotec and Hereaus.

If you'd like more information on attended the Wirebonding Seminar at EMPC, please email Mark Shaw: segreteria@empc2009.org

For our readers convenience, I have attached directions to EMPC 2009.