Wire Bonders' Speak

Highlights of Advanced Micro-Optoelectronic Interconnection Technology Seminar in Shanghai, China

Here are the highlights for those that weren't able to attend.

1) Fundamentals of Microelectronic and Optoelectronics Packaging, including:

• Packaging Formats and Thermal Design 
• Materials Used and their Properties
• Die to Package Interconnect Methods  

2) New advances in Assembly Tools: 

• Automated Precision Dispensers 
• Automated Ultra High Accuracy Die Bonders and Component Placement Systems (for such things as pick and place)
• Automated Die Bonders with super Flexible Work Areas (including Pulse Heat and Steady State for Eutectic Die Attach)
• Bond Testers, Die Sorters, Wire Pull Testers

3) A Survey of the Latest Trends on Microelectronic and Optoelectronic Packaging worldwide:

• Wafer Scale or Wafer Level Packaging
• 3D Packaging 
• TSV Die Stacking
• Embedded Dice in PCB  

Special emphasis was given to the interconnection process, especially hard solder eutectic chip attach. Nearly 150 top engineers and scientists from China were in attendance.  

Palomar Technologies and Beijing Yake held the full day seminar in Shanghai, on March 15th. Timing was appropo, as it took place days before Semicon China kicked off. Palomar CEO Bruce W. Hueners and Palomar Sr. Scientist Daniel D. Evans, Jr. were the key speakers of the event.  

For more information on Eutectic Die Attach, download Palomar Sr. Application Engineer, Zeger Bok's, Automated Eutectic Die Attach article.  

To speak with Palomar Asia about Palomar's award winning automated wire and die bonders or precision assembly services, please Contact Us.  

Its that time of year again in China. Semicon China (held in Shanghai this year) is one the largest and most important trade shows for the semiconductor industry. Semicon China is a good barometer of industry economics, future trends, and areas of growth (or otherwise). Case in point, China has the highest growth rate in the microelectronics industry and is expected to be the first to recover from the global recession. This year's show expects upwards 100,000 professional visitors, 1,000 exhibitors, 2,000 booths and 57,000 square feet of exhibit space. . This year's three theme pavilions will be 1) Reuse IC Fab Line Market and Ecosystem, 2) IC Applications of China Market, and 3) LED Manufacturing. New to the show is Semicon China's co-locations with SOLARCON China and FPD China. 

Palomar Technologies will be exhibiting with AST China in Booth #3559. Palomar will be doing two LIVE wire bonding and die bonding demonstrations.

Palomar's ultra flexible Model 3500-III Die Bonder and Automated Component Placement System with be performing:

• Flip Chip
• Component Handling
• Dot, Line, Pattern Epoxy Auger Dispensing
• Dot, Line, Pattern Time Pressure Epoxy Dispensing
• Eutectic Die Attach of Gold Tin (AuSn) with Pulse Heat Stage  - as part of this demonstration, Palomar's will showcase it's computer controlled Pulse Heat System including heat ramp and cool down graph "on-screen" along with the Pulse Heat Gauges that include cover gas, vacuum pressure, heating and cooling 
• Epoxy Daubing 

Palomar Technologies will also be doing a live wire bonding demonstration with its versatile, deep access Model 8000 Wire Bonder and Ball (Stud) Bumper. Palomar engineers will be displaying the wire bonder's capability in doing a flat ball bump and the the latest trend in Ball Bonding doing a short loop, called "stitch-stitch". The significance of "stitch-stitch" is that it the bonder creates a "bond" without setting down a "ball". This is very similar to wedge bonding, for it creates the same desired result (see image below). 

A manual system for die bond and wire bond will also be on display, in addition to a versatile wire pull, twist and die shear system.

The wire bonding and die attach applications are designed for atypical or odd form factor, complex microelectronic and optoelectronic packages. These packages are commonly used in military, aerospace, medical, telecommunications and consumer high technology industries. 

Palomar also offers precision contract assembly services through Palomar Microelectronics. These services are include supply chain management, prototyping, process development,  test, advanced packaging (wire bonding, die attach, eutectic and epoxy attach, LED packaging, RF Power Modules, complex hybrids, solar concentrators, LASERS,  and much more). All services are performed at Palomar's facility in Carlsbad, CA, USA with a full time, dedicated engineering staff and a vast high reliability equipment portfolio. Many non-US customers find Palomar's services a great value due to the high quality of work, managerial control on-site, its computerized paperless manufacturing laboratory, more for their money (due to decreased value of the dollar compared to other currencies), and protection of Intellectual Property.