Wire Bonders' Speak

Highlights of Advanced Micro-Optoelectronic Interconnection Technology Seminar in Shanghai, China

Here are the highlights for those that weren't able to attend.

1) Fundamentals of Microelectronic and Optoelectronics Packaging, including:

• Packaging Formats and Thermal Design 
• Materials Used and their Properties
• Die to Package Interconnect Methods  

2) New advances in Assembly Tools: 

• Automated Precision Dispensers 
• Automated Ultra High Accuracy Die Bonders and Component Placement Systems (for such things as pick and place)
• Automated Die Bonders with super Flexible Work Areas (including Pulse Heat and Steady State for Eutectic Die Attach)
• Bond Testers, Die Sorters, Wire Pull Testers

3) A Survey of the Latest Trends on Microelectronic and Optoelectronic Packaging worldwide:

• Wafer Scale or Wafer Level Packaging
• 3D Packaging 
• TSV Die Stacking
• Embedded Dice in PCB  

Special emphasis was given to the interconnection process, especially hard solder eutectic chip attach. Nearly 150 top engineers and scientists from China were in attendance.  

Palomar Technologies and Beijing Yake held the full day seminar in Shanghai, on March 15th. Timing was appropo, as it took place days before Semicon China kicked off. Palomar CEO Bruce W. Hueners and Palomar Sr. Scientist Daniel D. Evans, Jr. were the key speakers of the event.  

For more information on Eutectic Die Attach, download Palomar Sr. Application Engineer, Zeger Bok's, Automated Eutectic Die Attach article.  

To speak with Palomar Asia about Palomar's award winning automated wire and die bonders or precision assembly services, please Contact Us.