Wafer Bumping using a Ball (Stud) Bumping System
Posted by Rich Hueners on Sat, Apr 04, 2009 @ 01:23 PM
Wafer bumping involves putting a conductive material on each die pad on a wafer to attach it to a package or circuit board forming the first-level interconnect. Bumping has gained popularity due to demand for reduced package size, the need for improved electrical performance, and thermal transfer.
Wafer Bumping is achieved using a Ball Bonder or Stud Bumping System.