Posted by Rich Hueners on Fri, Aug 27, 2010 @ 11:57 AM
Advanced Packaging Software is arguably where a die or wire bonder is enabled to stretch and accomplish some extraordinary application challenges. We'll be discussing 2 software applications that have elevated complex packaging production efforts to increase yield and lower production costs: Automated Data Management and Analysis (ADMA) and Bond Data Miner (BDM).
ADMA: Global Paperless Production Management
The term "paperless laboratory" was mentioned to me earlier this year during a meeting with an engineer. He was describing the new software architecture that was being implemented in Palomar's contract assembly lab...called Automated Data Management Analysis or ADMA (trademark).
In describing ADMA, he got right to the point he said "a lab's biggest contaniment is people...the majority mistakes come from human error...to the world's manufacturing companies are only spreading out more, and doing so globally...in these far away factories, with management/engineering 10,000 miles away, really good packaging process know how is rarely on the factory floor". By eliminating dirty notebooks and pencils, inputing data into a controlled and clearly mapped out database (via PC), and working through a smart system of work order flow tags, a networked paperless production operation is achieved.
In addition to working with wire and die bonding systems, complementary equipment such as dispensers, inline handlers, magazine hanldlers and test equipment can be included into the ADMA infrastructure. ADMA started out as a solution for Palomar's Microelectronic's lab (the Contract Assembly division of Palomar Technologies). In starting here, it was concieved in real world production environment, not some theoritcal product concept brainstorm. Today ADMA goes beyond Palomar Microelectronics - it is implemented on islands of automation (single bonders) on factory site as well as on multiple systems in multiple locations.
Think of the "Command Center" at NASA. See all the screens and monitors, each tracking different aspects of the space shuttle's lift off: charts on one, goegraphical maps on another, a live feed on yet another, an interactive database on another, and up to the moment information pouring in through each channel... this is an image of how ADMA works, put in the microelectronic packaging context of course. 
Take company "XYZ LED": a technician in the Phlippines is operating a 5 machine ultra high accuracy pick and place system, Management is in Washington D.C, Process Engineers are in Germany, the Engineering Manager is traveling in Turkey. Each, from their PCs can enter into the ADMA enviornment remotely and manage the production:
- Management can pull yield data from their desks in the USA
- the Process Engineers can input work orders from Europe
- the Engineering Manager, from his hotel room in Turkey, can closely monitor the System's uptime and provide direction to the Process Engineer
- the Techician in the Phillipines recieves his/her order and simultanously tightens the feeback loop through site ID tracking (finding the error site on 3000 site wafer is a tedious process without this tool)
Bond Data Miner: just what is says
Bond Data Miner or BDM was developed first as a tool for Palomar Model 6500 die bonder. As the accuracy of this machine is so precise (1.5 micron), there was a need to find errors that amounted to as .1 micron. Additionally it became clear that both Palomar Microlectronics and our customers needed a way to track trend and machine calibrations, aggregate run data and time stamp data sets. Bond Data Miner was concieved and then created. The result was a much more comphrensive, centralized data management and analysis system (BDM works in concert with ADMA, as a part of ADMA).
Bond Data Miner is also unique in that each machine has its own BDM. In the case of multiple machines, data is pulled from local machines and into the Factory BDM database. The Factory BDMdb would reside on a seperate server, along with ADMA. Data can be analyzed locally or by the Factory BDMdb. Like most data software, the information can be copied on a scheduled basis in duplicate or deleted, and be burnt to other hardrives or CDs. All of Bond Data Miner databases are stored on RAID drives.
The benefits of this software include on-demand working knowledge Uptime, Trends and Yield.
- Has the calibration drifted?
- Is the machine performing baseling tests with the same result as before?
- What parts, by identifier, went into what assembly?
- What parts had assembly errors? (and will skip in later processes)
- What was the calibration status during a part build?
- What consumables, by identifier, were used during the parts assembly?
- Is the process trending towards Yield loss?
Smart Software = Increase Yield
Why is Yield important? Lets look at what the value of 1% yield is in the following example:
- 12,000 die bumped/year
- $0.50 cost per die
- 1% yield improvement = $60,000 in savings/year
+1% delta Yield = $300,000 in cost savings over 5 years!
Posted by Rich Hueners on Fri, Jul 23, 2010 @ 03:49 PM
Semicon West 2010 was an important show for Palomar, most especially due to the launch of Palomar's new 3800 Ultra Flexible Die Bonder. The 3800 highlight features include 3.5 micron repeatability, 3 sigma and 2600 UPH. Palomar's booth saw lots of traffic, lots of interested eyes fascinated with the 3800's sophisticated and aesthetically pleasing design and mechanics.
Here are some highlighted reflections:
- Like most US trade shows, smaller, less equipment and less well-attended than a decade ago. Certainly a sign of the times: the impact of the internet and the dominance of Asia as a target market for semiconductor equipment
- Even so, the trade show remains a great forum for prospective buyers to directly see and compare competitive products and companies all in one location. There is still no substitute for going down to the lot and ‘kicking the tires’ when you’re in the market.
- Palomar was distinctive at Semicon 2010 as one of the very few companies that had a new product to show. And Palomar had done extensive pre-show promotion to generate excitement and curiosity surrounding the launch of its new product. You could feel it in the air.
- For Palomar, the combination of a new product launch and strengthening in the semiconductor capital equipment market made Semicon 2010 one of its best trade shows in years.
Laurie Roth, Market Research Consultant, used the words "upbeat" to describe this years show. She also talks about the new challenges contract manufacturers will face in the near future: in essence, the applications methods and solutions are there, it will just be a matter of which method to use. It was certainly upbeat, exhibitor attendance was higher than the last few years and certainly visitor traffic was way up.
Let me share with you 2 video interviews conducted on site at the Palomar booth, during the show.
First up, Laurie Roth, a semiconductor industry veteran:
Next up, Jim Hisert from Indium Corporation, talks about Palomar's new 3800 ultra flexible die bonder and its new ergonomic features. Jim also discusses how Palomar's 3800 large work area is a major benefit to customers with high mix/low-medium volume mircoelectronics manufacturers - the ability to customize across a wide variety of applications.