Posted by Rich Hueners on Mon, Aug 09, 2010 @ 03:52 PM
Today's production facilities have their own unique set of components, design characteristics and assembly requirements. Before purchasing a new automated die attach machine, a buyer will usually require a proof of performance. This proof of performance comes by way of a demonstration; showing the customer that the assembly equipment will be able to meet their current needs AND show adaptability and flexibility which will meet requirements still in the development stages. Due to the high cost of quality capital equipment, it is important to choose a machine and a vendor that see a customers' big picture needs. If this is not considered, one could run into the problem of having made a significant investment into a machine that works on only 1 or a few applications. 
The requirement for narrow production tolerances is 1-2 mils or better. This is driven by the manufacturers need for consistency, reliability, and quality in highly compact package.
Hybrid circuits and MCMs (mult-chip modules) are often highly populated and densely packed. In some cases, errors slightly larger than +/- 0.5 mil could cause a part to short, overheat, or otherwise malfunction - in other words, the part would be rejected. Accurate component placement is a key factor in maximzing production waste.
When a hybrid/MCM application is highly complex, Palomar's new 3800 die bonder and automated component placement system is challenged to meet a set of performance specifications. A Palomar applications engineer will evaluate the product and process requirements. A test substrate is designed to hold a sampling of components with characteristics and challenges similar to those currently found in the customer's production facility AND those forseen for future production. Components are arranged on a substrate to exercise the vision and dexterity of the die attach machine, its ability to recognize components and to carefully pick, rotate and place them accurately.
When the die bonder is set up to assemble the sample part, the specifications and features for the machine's standard and optional equipment are scruntinized. Basic factors considered for a task are the work envelope (size and features) and machine robotics, computer control and programming capabilities , vision and pattern recognition, dispense options, and component presentation and application options.
The real value provided in the die attached demonstration is the prep work done prior, the process. The process is where the real expertise comes in and where the customer will find a lastly, money making solution. A good die bonder with a good process will in effect, print money.
Posted by Rich Hueners on Fri, Jul 23, 2010 @ 03:49 PM
Semicon West 2010 was an important show for Palomar, most especially due to the launch of Palomar's new 3800 Ultra Flexible Die Bonder. The 3800 highlight features include 3.5 micron repeatability, 3 sigma and 2600 UPH. Palomar's booth saw lots of traffic, lots of interested eyes fascinated with the 3800's sophisticated and aesthetically pleasing design and mechanics.
Here are some highlighted reflections:
- Like most US trade shows, smaller, less equipment and less well-attended than a decade ago. Certainly a sign of the times: the impact of the internet and the dominance of Asia as a target market for semiconductor equipment
- Even so, the trade show remains a great forum for prospective buyers to directly see and compare competitive products and companies all in one location. There is still no substitute for going down to the lot and ‘kicking the tires’ when you’re in the market.
- Palomar was distinctive at Semicon 2010 as one of the very few companies that had a new product to show. And Palomar had done extensive pre-show promotion to generate excitement and curiosity surrounding the launch of its new product. You could feel it in the air.
- For Palomar, the combination of a new product launch and strengthening in the semiconductor capital equipment market made Semicon 2010 one of its best trade shows in years.
Laurie Roth, Market Research Consultant, used the words "upbeat" to describe this years show. She also talks about the new challenges contract manufacturers will face in the near future: in essence, the applications methods and solutions are there, it will just be a matter of which method to use. It was certainly upbeat, exhibitor attendance was higher than the last few years and certainly visitor traffic was way up.
Let me share with you 2 video interviews conducted on site at the Palomar booth, during the show.
First up, Laurie Roth, a semiconductor industry veteran:
Next up, Jim Hisert from Indium Corporation, talks about Palomar's new 3800 ultra flexible die bonder and its new ergonomic features. Jim also discusses how Palomar's 3800 large work area is a major benefit to customers with high mix/low-medium volume mircoelectronics manufacturers - the ability to customize across a wide variety of applications.
Posted by Rich Hueners on Fri, Jul 16, 2010 @ 02:53 PM
As a software engineer, I don’t often get to go to trade shows, but Semicon West 2010 was one I could not miss. After working intensely over the last few months with the Palomar engineering team on the 3800 Die Bonder and preparing to show it to the world at SEMICON…attending, if only for opening day, was something I needed to do for myself. Call it professional satisfaction. With that said, I want to share some of my experiences and impressions of Semicon 2010, Palomar's booth, and the showing of the new 3800 die bonding machine. The last time I went to Semicon was in the late 1990s when Palomar launched its CBT 6000 (which later became the current 8000 Wire Bonder).
Quick Bit
Semicon 2010 was held at Moscone Center in downtown San Francisco. There are three main exhibit halls, Moscone South, Moscone North, and Moscone South. Palomar's booth was in the North hall which was for the "Test, Assembly, and Packaging" segment of the semiconductor equipment manufacturing and supply industries. The South hall was for "Wafer Processing" and the West hall was for the Solar industry. I visited the South and North halls, but not the West hall.
Monday 7/12 – Set up
The exhibit halls were only open to the exhibitors and the various convention center support people such as electricians, general labor, security, etc. Like the few other conventions I have been to on setup day, it was an organized chaos. There were forklifts buzzing by with large crates, laborers putting down carpet, electricians setting up power drops and exhibitors semi-desperately trying to get all their stuff placed in their booth and working to some level.
Tuesday 7/13 – Opening Day
As 10 am rolled around, I went out to walk the floor and look at what the other vendors had going on.
Just before lunch, I walked by the Palomar booth and found it was jammed with people. Every Palomar person was talking with one or two visitors, and some as yet unengaged visitors in the walkway were watching the machine (still running its demo) or the process camera live the 46” video display. It looked crazy! Meanwhile the booths around Palomar's were dead in comparison. 
Palomar's booth on Tuesday, July 13th
I walked over to the South hall, where the "Wafer Processing" related things were going on. After walking the whole floor, it seemed that very few vendors had any kind of significant machinery on display. Not knowing really anything about wafer processing myself, most of the booths weren't of any real interest to me. There was one booth that had a demo of an air-bearing table seemingly made of granite with small metal rails - it had some kind of wafer handling arm on it and it was whisper quiet from what I could tell (although the hall was pretty noisy). Despite the South hall being bigger than the North hall, it seemed that there were less people total in the South hall - maybe less people interested in wafer processing?
On Tuesday, the exhibit floor closed at 5pm. But, if you are REALLY interested, you were able to hang out a bit longer. This was evident in what I soon saw back at the Palomar booth: one last gentleman was at the excitedly asking Mike Artimez, our on-site engineer, a bunch of questions. He seemed new to the Palomar product line, so he was totally focused on looking at the 3800 machine and not really paying attention to anything else. Far after 5 PM, he looked up and realized that almost all the other visitors and large portion of the exhibitors themselves had already left the floor. Surprised and still excited, he said his goodbyes and left, saying he'd be back tomorrow to talk some more.
Palomar's Design Engineer Mike Artimez shows an interested visitor the new 3800 Die Bonder
An Engineer’s Dream
Having spoken to many different people who have attended Semicon for years and decades on end, this year was certainly an “up” year. As for the show itself, overall, it was clearly a success. More than anything, I reached the height of “professional satisfaction” in watching a great number of engineers and industry professionals watch the new 3800 die bonder with intense interest and excitement. All the hard work that was put into the 3800 by so many people at Palomar paid off in simply watching the sparkle in the eye of each visitor when watching the machine run. As an engineer, to create a product that other people find useful and valuable is most definitely the ultimate payoff. I feel lucky to have been there.
Here is to growth and prosperity for all semiconductor companies worldwide!
-Raul Rathmann