Palomar Microelectronics applies its understanding of economic realities of modern advanced packaging (with its high equipment and labor costs) in conjunction with the need for process development and low volume production on a limited scale.

MicroElectronics standard development process include Package Design and Analysis, Ball Bumping, Metrology, Package Sealing, SMT, Pilot Builds, Wire Bonding, and Ultra High Accuracy Component Placement

Palomar's Model 8000 Wire Bonder / Ball Bonder is uniquely suited to yield high reliable low profile interconnects.

Palomar's Model 6500 Ultra High Accuracy Eutectic Die Bonder can also be configured to handle Wafer Scale Packaging