Palomar
Microelectronics applies its understanding of economic realities of modern
advanced packaging (with its high equipment and labor costs) in conjunction
with the need for process development and low volume production on a limited
scale.
MicroElectronics standard development process include Package Design and Analysis, Ball Bumping, Metrology, Package Sealing, SMT, Pilot Builds, Wire Bonding, and Ultra High Accuracy Component Placement