What is your Packaging Challenge?

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Wire Bonding / Wire Bumping: Pitch Requirement?

Wire Bonding / Wire Bumping: Wire Size?

Wire Bonding / Wire Bumping: Wire Type? If Gold Wire, please indicate:

Wire Bonding / Wire Bumping: Throughput Required? (wires/sec or bumps/sec)

Wire Bonding / Wire Bumping: Precision Required? (if possible indicate, X/Y and Z axis)

If other, please tell us:

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Experts in high precision & high accuracy automated wire bond, gold wire bond and component placement technology

Contract Assembly services are performed by our experts on our systems and include Wafer Scale Packaging, RF amplifiers, Power LED Arrays, MEMs, Hybrids
Palomar's Application Engineering experts can take you from concept to production by providing Process Development, Prototyping and Volume Assembly guidance, helping your company speed time-to-market control costs and reduce risk
By automating the most complex manufacturing processes, Palomar's Systems have the highest impact on your yield and manufacturing costs.

It is our mission to enable our customers to overcome their microelectronic and optoelectronic assembly challenges in a cost-effective manner.