Communication Devices

Automated Eutectic Die Attach is the premier method for packaging high power and high frequency communication devices.

Die Bonder - Wafer Scale Packaging

Eutectic Profile

Pulse Heat Stage - Eutetic Die Attach Pictured above is the Pulse Heat Stage profile of a Eutectic Die Attach application.

Your Solution is on the house

Present us with your microelectronic or optoelectronic packaging challenge and we will propose a solution at no cost. If you have an idea, we have a solution.

Some challenges we have overcome recently:

High Bright / High Power LED Packaging
Higher throughput for RF Packages using the Chain Bonding method with a Gold Ball Bonder
Automated Eutectic Die Attach for High Power Communication Devices
Micro-Optical Wafer Scale Packaging

Palomar MicroElectronics is a full-service advanced packaging lab that specializes in the development, test, prototyping and design of a wide variety of micro/optoelectronic needs for customer's worlwide.

System + Expert = Solution

Automated Mult-Chip Eutectic Die Attach

Palomar's Model 3500-III Die Bonder and Automated Component Placement System is pictured above. This is configured for Multi-Chip Eutectic Die Attach applications.

Complimentary Solution Form

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