Automated Die Bonder

3500 Die Bonder - engineer
 
Palomar's Microelectronics performs automated assembly applications

Equipment for Advanced Packaging - Article

Palomar Technologies CEO Bruce W. Hueners writes "as an enabling technology, automated microelectronic and photonic manufacturing equipment is the engine that propels today's product concepts from the laboratory into large-scale commercial, military and industrial prominence... In the leading edge of the market, emerging
packaging methods and novel materials provide the impetus for innovative packaging and interconnection processes and equipment."

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