Palomar's 8000 Wire Bonder/Ball (Stud) Bumper is a fully automated wire bonding packaging system designed for high relaibility, high precision wire bonding and ball bumping. It's large work area, ability to customize stages and tooling, along with a 0.75" capillary make it an ideal solution for complex, deep, and aytpical or rare packaging challenges.
Highlighted specs:
- Cycle Time: 0.125 sec/wire, 0.077 sec/bump
- Placement Accuracy: +/- 2.5 micron, 3 sigma
- Large Work Area: 12"x6" with option for dual side by side stages
8000 Options inlcude Tailess Bump Mode, Stand-Off-Stitch (Auxiliary Wire), TAB Bonding, and One-Step Planar Gold Bumps.